The US Defense Microelectronics Activity has selected Northrop Grumman as one of the companies eligible to receive task orders under the Advanced Technology Support Program V, a contract vehicle with a total potential value of $25 billion. The program is intended to speed the delivery of American-made microelectronics into military systems and strengthen the resilience of US defense supply chains.
ATSP V allows participating companies to rapidly respond to government requirements, with Northrop Grumman able to submit proposals within 30 days of a request. The company expects the timeline from proposal to contract award to average between 80 and 90 days, significantly reducing acquisition delays for critical microelectronics technologies.
The indefinite-delivery, indefinite-quantity contract supports a broad range of technical capabilities, including advanced semiconductor fabrication, innovative packaging solutions, and next-generation materials engineering. Alongside Northrop Grumman, nine additional firms were selected for the program, including Raytheon, L3Harris Technologies, General Dynamics Mission Systems, Leidos, HII Mission Technologies, Battelle Memorial Institute, DRS Network & Imaging Systems, Charles Stark Draper Laboratory, and Vertex Aerospace.
The ATSP V award follows a series of major US defense microelectronics contracts aimed at boosting domestic production capacity. In September 2023, GlobalFoundries secured a 10-year contract with a $3.13-billion ceiling to supply trusted microelectronic products for defense agencies. In 2024, IBM was awarded a DMEA contract valued at up to $576 million to establish a trusted enclave within commercial semiconductor manufacturing to support sensitive defense and national security applications.
